Global ESD Foam Packaging Market by Type (Conductive and Dissipative Polymer, Metal, Additive), By Application (Electrical and Electronics, Automobile, Defense and Military, Manufacturing, Aerospace, Others) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast To 2028

The Global ESD Foam Packaging Market size is projected to grow at a CAGR of 9.5% during the forecast period. The growth can be attributed mainly to increasing demand for ESD packaging in electrical and electronics, automotive, defense and military, manufacturing, aerospace industries.

ESD foam packaging is a type of insulation material that helps to minimize the effects of electrostatic discharges (or ESDs). In other words, this makes sure that static charges do not damage sensitive electronic components. The name "E-Foam" or "Electro Static Dissipative Foam" refers to its main purpose: removing, dissipating, and grounding electrical charge buildup from human skin and equipment surfaces. It does so by producing an electric field with higher potential than the air around it - about 1000 V/m (about 20 kV/cm) in magnitude. This can be done through either conductive polymer foam or metalized polyurethane foam. The latter notably works well for shielding sensitive electronics in close proximity to the foam. Conductive polymer foam, on the other hand, is typically used as a form of packaging for sensitive electrical and electronic equipment such as computer motherboards or circuit boards.

On the basis of Type, the global ESD foam packaging market is segmented into Conductive Polymer and Dissipative Polymer Foam.

Conductive Polymer:

Conductive polymers are a type of polymer that has properties suitable for ESD control. They can be used to suppress the discharge current, hinder surface charges from forming on conductors and increase capacitance in circuits. Conductivity is determined by the site-to-site interaction between fragments (usual chains) of similar or dissimilar lengths dispersed throughout the amorphous phase. It can be used in various applications, such as manufacturing and aerospace industries. The conductivity of this material makes it suitable for electronics or electrical purposes because the materials do not interfere with electromagnetic waves. This also means that people are able to use their hands without feeling any static shocks when coming into contact with other metals. Their gloves are generally made out of neoprene rubber and polyester which gives them an elegant look while still being tough enough to provide protection from different hazards around the workplace - like molten metal on tools, soldering irons, welding equipment, etc. They have excellent resistance against extreme heat and cold temperatures (-40 °F/-40 °C). These gloves are also able to withstand chemicals such as battery acid, oils, and solvents.

Dissipative Polymer:

A dissipative material is one that has an electrical resistance so high that it does not significantly impede electric currents but offers some protection against static electricity generation while being easily grounded if necessary. Dissipative materials include natural rubber with carbon black filler; metal oxides such as silicon dioxide (SiO), zinc oxide ([ZnO] and barium oxide ([BaO]); metal soaps; carbon paste, as well as polymers made of aromatic amines or other substances. Dissipative polymer foam is a type of environmentally-friendly ESD packaging, made from new materials with good insulation properties and environmental protection. In the ordinary environment, Dissipative Polymer Foam has no conductivity at all (the resistivity can reach several million ohms).

On the basis of Application, the global ESD foam packaging market is segmented into Electrical and electronics (E&E), Automobile, Defense & Military Applications, Manufacturing Industries, and Others (Aerospace).

Electrical And Electronics (E&E):

The global ESD foam packaging market in Electrical and electronics (E&E) is largely used for the protection of static sensitive devices. In this application segment, Conductive Polymer Foam has been widely accepted due to it excellent performance characteristics such as high conductivity that can be obtained by using a small amount of electrolyte, low cost with good insulator property against humidity so that these are easy to recycle. The major applications include Industrial PCs: These include computers used in factories or assembly lines where they typically operate on an enclosed metal chassis; Storage Devices & Media: This type includes CDs, DVDs, and other storage media. They should not come into contact with any material which might cause a discharge while being stored or handled; and Computer Components: This includes items like circuit boards, motherboards, hard drives.

Automobile:

The use of ESD foam packaging in the Automobile sector is to protect from electrostatic discharge. The high-voltage car battery, for example, could produce a dangerous spark when touched by an unsuspecting person wearing rubber gloves. A device that generates static electricity can be used to charge up any surface and then discharged on demand - called electrocution or "zapping." It helps to reduce impact from shocks and vibrations, prevent physical contact with other parts, and thus reduces the possibility of potential short circuits or component damage due to electrostatic discharge.

Defense & Military Applications:

Defense and Military is an application of ESD foam packaging that deals with the protection against any kind of attack. In this type, metal foams are used in order to shield against electromagnetic waves or high-energy particles. This shielding can provide defense for many different types of industries such as aerospace, military ground forces, sea vessels, etc. These companies have been using these shields since they are not easily destructible by conventional weapons like missiles which gives them a great advantage over their enemy.

Manufacturing Industries:

ESD foam packaging is very important in manufacturing industries as it prevents static electricity from damaging sensitive products. The ESD foam packaging can absorb the charge of an object and discharge a lower voltage on its surface. It also provides protection for objects against electrostatic forces generated by humans, or other sources like machinery, flooring materials, or lightning strikes; which may cause sparks to fly off those surfaces and destroy delicate electronics devices nearby.

On basis of Region, the global ESD foam packaging market is segmented into North America, Latin America, Europe, Asia Pacific, and Middle East & Africa. The North American region is anticipated to emerge as the most lucrative market for ESD foam packaging. The key factor driving growth in this region is robust demand from the automotive industry. Furthermore, the growing adoption of electronic gadgets and increasing usage of mobile phones across various demographics are expected to drive revenue generation potentials for the regional players over the forecast period. The Latin American region accounted for a significant share in global revenues generated through sales of ESD foam packaging during 2017-2028; however, it has been witnessing sluggish performance owing to unfavorable economic conditions prevailing since late 2011. This decline is also attributed to inadequate investments by companies operating in this part of the world. European countries such as Germany, France, Italy, and the UK were among the top contributors to the global ESD foam packaging market. The share of these economies was mainly attributed to their high adoption rates in the automobile industry where the use of conductive polymers is on a vast scale. Due to the high adoption rate of the conductive polymer in the automotive industry, Germany was one of the leading countries contributing to the growth of the global ESD foam packaging market. In the 2017- 2028 period, it is anticipated that Germany will continue its dominance owing to favorable economic conditions prevailing throughout these years. Italy has been witnessing a decline since late 2011 and this trend is expected to carry on until 2021. The Asia-Pacific region has been witnessing an increasing demand for electric vehicles which will drive revenues generated from sales of ESD foam packagings over the forecast period. Emerging markets such as China and India are expected to contribute significantly towards future growth considering that countries here hold large numbers of manufacturing plants.

Growth Factors For The Global ESD Foam Packaging Market:

The growth of the global ESD foam packaging market is driven by a number of factors such as increasing sales and demand for electronic devices, increasing use of electronics in automobiles, high awareness about safety elements among consumers. The large installed base coupled with cost-effective production methods will drive product volumes over the foreseeable future. In addition to this, there are other factors that include growing customer preference for products containing environmentally friendly materials like polyurethane (PU) resin/materials due to environmental concerns; increase in R&D activities on advanced PU polymer formulations; rise in usage rates across various industry verticals including automotive and aerospace sectors which could be further strengthened through an extensive research & development roadmap; and growing development on products based on Biopolymers, Cellulosics, and other renewable materials.

Up Market Research published a new report titled “ESD Foam Packaging Market research report which is segmented by Types (Conductive and Dissipative Polymer, Metal, Additive), By Applications (Electrical and Electronics, Automobile, Defense and Military, Manufacturing, Aerospace, Others), By Players/Companies Nefab, Tekins, Elcom, GWP Group, Botron, Conductive Containers, Helios, Electrotek, Statclean”. As per the study the market is expected to grow at a CAGR of XX% in the forecast period.

Report Scope

The report covers comprehensive data on emerging trends, market drivers, growth opportunities, and restraints that can change the market dynamics of the industry. It provides an in-depth analysis of the market segments which include products, applications, and competitor analysis.

Global ESD Foam Packaging Market Report Segments:

The market is segmented by Type Conductive and Dissipative Polymer, Metal, Additive and By Application Electrical and Electronics, Automobile, Defense and Military, Manufacturing, Aerospace, Others.

Some of the companies that are profiled in this report are:

1. Nefab
2. Tekins
3. Elcom
4. GWP Group
5. Botron
6. Conductive Containers
7. Helios
8. Electrotek
9. Statclean

ESD Foam Packaging Market research report delivers a close watch on leading competitors with strategic analysis, micro and macro market trend and scenarios, pricing analysis and a holistic overview of the market situations in the forecast period. It is a professional and a detailed report focusing on primary and secondary drivers, market share, leading segments and geographical analysis. Further, key players, major collaborations, merger & acquisitions along with trending innovation and business policies are reviewed in the report.

Key Benefits for Industry Participants & Stakeholders:

• Industry drivers, restraints, and opportunities covered in the study
• Neutral perspective on the market performance
• Recent industry trends and developments
• Competitive landscape & strategies of key players
• Potential & niche segments and regions exhibiting promising growth covered
• Historical, current, and projected market size, in terms of value
• In-depth analysis of the ESD Foam Packaging Market

Overview of the regional outlook of the ESD Foam Packaging Market:

Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa (MEA). North America region is further bifurcated into countries such as U.S., and Canada. The Europe region is further categorized into U.K., France, Germany, Italy, Spain, Russia, and Rest of Europe. Asia Pacific is further segmented into China, Japan, South Korea, India, Australia, South East Asia, and Rest of Asia Pacific. Latin America region is further segmented into Brazil, Mexico, and Rest of Latin America, and the MEA region is further divided into GCC, Turkey, South Africa, and Rest of MEA.

Highlights of The ESD Foam Packaging Market Report:

1. The market structure and projections for the coming years.
2. Drivers, restraints, opportunities, and current trends of ESD Foam Packaging Market.
3. Historical data and forecast.
4. Estimations for the forecast period 2028.
5. Developments and trends in the market.
6. By Type:

                1. Conductive and Dissipative Polymer

                2. Metal

                3. Additive

                1. Electrical and Electronics

                2. Automobile

                3. Defense and Military

                4. Manufacturing

                5. Aerospace

                6. Others

8. Market scenario by region, sub-region, and country.
9. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
10. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
11. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the ESD Foam Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2028.

How you may use our products:

• Correctly Positioning New Products
• Market Entry Strategies
• Business Expansion Strategies
• Consumer Insights
• Understanding Competition Scenario
• Product & Brand Management
• Channel & Customer Management
• Identifying Appropriate Advertising Appeals

Reasons to Purchase the ESD Foam Packaging Market Report:

• The report includes a plethora of information such as market dynamics scenario and opportunities during the forecast period
• Segments and sub-segments include quantitative, qualitative, value (USD Million,) and volume (Units Million) data.
• Regional, sub-regional, and country level data includes the demand and supply forces along with their influence on the market.
• The competitive landscape comprises share of key players, new developments, and strategies in the last three years.
• Comprehensive companies offering products, relevant financial information, recent developments, SWOT analysis, and strategies by these players.